Technologies

EXTENSIVE DESIGN EXPERIENCE
uBGA, RF, High Speed Digital, Analog, Mixed Signal designs
Complex board builds, blind, buried, micro vias, multiple laminations and combined materials
Impedance controlled: Differential, Single ended, Stripline and Surface Microstrip, Embedded Microstrip
Mechanical: Sockets, Shielding, Systems, Custom Stiffeners, Cables

PCB PARAMETER	PRESENT CAPABILITIES
Layer count	60
Board thickness	7.00 mm
Board size	810 mm x 580 mm
Line/spacing Inner (µm) Outer (µm)	0.035 mm 0.035 mm
Min. finished hole diameter Mechanical (mm) Laser (mm)	0.075 mm 0.070 mm
Aspect ratio PTH Laser	30 1.0
Micro BGA µm (pitch)	110
Pad size Space between pads	0.090 mm 0.020 mm
Solder Mask Registration accuracy	0.010 mm
Impedance tolerance	+/- 5 %

BOARDS ASSEMBLY
Leading edge assembly technologies allowing to scale from prototypes to high volumes
Very high components density
Full flying probe test capability on assembled boards
Enhanced Quality Control leveraging 3D X-Ray