Solutions

Quality & Reliability and Burn-In

Innovation in Q&R and Burn-in

Universal Reliability & Test System

  • Test environment integrated with ATPG Tools
  • Highly flexible testing platform FPGA-based
  • Open architecture programming language
  • Wide range of modular and scalable power supply and analog resources
  • High testing performances (up to 304 I/Os)
  • Deep pattern memory (over 100 Mvectors)
  • Test platform upgradable with analog and digital modules (PSU, RF, Optical, LTC)
  • User Interface fully customizable according to customer needs
  • Extensive data logging and reporting capability
  • Full integration with Thermal and Climatic Chambers and Local Temperature Control solutions
  • Plant Data Warehouse and Factory Automation
  • Remote System management

Innovation in Q&R and Burn-in

Modular Thermal Chambers

  • High thermal performances
  • Configuration scalability based on modular platform with “plug & play” approach
  • Automated board insertion/extraction mechanism
  • Minimized energy consumption, minimum noise and no vibrations
  • Adaptive air flow
  • Very fast temperature ramps (up to 10°C/min)
  • Low MTTR due to the easy replacement of the chamber modules
  • Very efficient thermal insulation guaranteeing potentially unlimited trials at negative temperatures

Guidelines for Q&R and Burn-in Solutions

OPTIMIZATION

System HW resources configurable to best fit the Applications requirements and open shared SW libraries to exploit “design reuse”

SCALABILITY

HW and SW module upgradable as plug-in and customizable according to the Application needs

CONFIDENCE

Same Test Boards, Test Architecture and Application know-how across all Test Platforms, open source Programming Language

CONTINUITY

Capability to integrate third party test Boards standards

APPLICATION

Integrated Application Environment managing all system resources and fully compatible with Factory Automation

Q&R and Burn-in system

High performance over a wide range of solutions

  • High precision Very Low Voltage (less than 0.5V)
  • Medium Power (over 200W per device)
  • Very High Voltage (3kV)
  • Very High Temperature HTOL (up to 220°C)
  • LTOL at -55°C
  • PTC Tests

Q&R Applications Coverage

  • CUBE 480: medium to very low voltage and low power devices with high pin-count and high parallelism
  • CUBE 700: medium to very low voltage and medium power devices with very high PS granularity, high pin-count and analog features
  • CUBE NeXT: very high to very low voltage and medium power devices with high pin-count and analog features
  • UDx75K: “intelligent THB/HTRB” through the integration with existing climatic chambers
  • UDx75K SS: “semi-static THB/HTRB” through the integration with existing climatic chambers

Taster Platform

  • Test Architecture based on the concept of Distributed Resources
  • Configurable Digital Resources as Vector or Protocol Based approach
  • PS Modularity in wide current and voltage domains
  • Analog Stimulations and Monitoring
  • Integrated Development Environment
  • Customizable User Interface
  • Programming based on open libraries
  • Extensive Datalogging and Reporting
  • Native integration of Local temperature Control solutions

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Thermal Chambers

  • High Thermal Performance with compact footprint and optimized energy consumption
  • Thermal Chamber Modularity and Configurability
  • Integrability of multiple drivers and boards standards
  • Automation-ready from both SW and Mechanical point of view

CUBE 75K

  • Reliability tests with stimulations and monitoring of Power Supplies and Signals
  • Independent configuration of multiple Power Supplies for each Reliability board
  • Integrated data logging of electrical and environmental test conditions
  • Unique management system for both tester electronics and climatic chamber
  • Address
  • Via Milano, 15I/15L
    25032 Chiari - Brescia (BR)
    Italy
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